Mold-Cooling System and Mold-Cooling Method
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United States of America Patent
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Issued Date -
Sep 1, 2016
app pub date -
Oct 3, 2014
filing date -
Oct 7, 2013
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Abstract
A mold-cooling system for cooling a heated mold by supplying cooling medium from a cooling medium supply source to a medium flow path provided for a mold. The mold-cooling system is characterized in that a discharge side path connected to an outlet side of the medium flow path of the mold is communicated with a heat exchanger condensing the cooling medium gasified and discharged from the medium flow path.
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