SOLDER TRANSFER SHEET
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United States of America Patent
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Issued Date -
Sep 1, 2016
app pub date -
Nov 5, 2014
filing date -
Nov 5, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
The present solder transfer sheet addresses the issue of providing a solder transfer sheet having both solder powder holding properties and sheet releasing properties and having excellent solder transfer properties. This solder transfer sheet is for soldering in a section to be soldered in a circuit substrate and has: a support base material; an adhesive layer provided on at least one surface of the support base material; and at least one solder layer including solder particles, provided upon the adhesive layer. The adhesive layer contains a side-chain crystalline polymer, exhibits viscosity by having fluidity at at least the melting point of the side-chain crystalline polymer, and decreases viscosity by crystalizing at temperatures less than the melting point of the side-chain crystalline polymer.
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