Heat flow meter and electronic device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10260965
APP PUB NO 20160252407A1
SERIAL NO

15053531

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat flow sensor includes a heat transfer layer that has first and second surfaces confronting each other and has flexibility and a temperature difference measurement unit that measures a temperature difference between the first and second surfaces of the heat transfer layer. The heat transfer layer includes a first member having flexibility and a second member with higher thermal conductivity than the first member. The thickness of the heat transfer layer is equal to or greater than 0.5 mm, thermal conductivity of the heat transfer layer is equal to or greater than 10 W/(m×K), and Shore hardness of the heat transfer layer is equal to or less than A50.

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Patent Owner(s)

  • SEIKO EPSON CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeda, Akira Chino, JP 152 795
Shimizu, Sakiko Matsumoto, JP 15 85

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