Interposer and electronic component
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United States of America Patent
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Oct 17, 2017
Issued Date -
N/A
app pub date -
Dec 29, 2015
filing date -
Feb 27, 2015
priority date (Note) -
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Abstract
The present application provides an interposer, including an interposer substrate, at least one through silicon via, a first shield layer, a first insulation layer, a first cable layout layer, and at least one first bump. The interposer substrate includes an upper surface and a lower surface; the at least one through silicon via is buried in the interposer substrate and runs through the upper surface and the lower surface; the first shield layer is disposed on the upper surface of the interposer substrate and the first shield layer has electrical conductivity; the first insulation layer is disposed at the first shield layer; the first cable layout layer is disposed at the first insulation layer and is electrically connected to the at least one through silicon via.
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