Systems and Methods Utilizing Anisotropic Conductive Adhesives
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United States of America Patent
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Issued Date -
Sep 1, 2016
app pub date -
May 11, 2016
filing date -
May 31, 2013
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Abstract
Illustrative embodiments of systems and method utilizing anisotropic conductive adhesive(s) (“ACA”) are disclosed. In at least one illustrative embodiment, a substrate may comprise one or more electrical contacts, and one or more integrated circuits may be secured to the substrate by ACA. The ACA may comprise a plurality of particles suspended in a binder, where the plurality of particles form electrically conductive and isolated parallel paths between the one or more electrical contacts and the one or more integrated circuits as a result of the ACA being subjected to a magnetic field before or during curing of the binder.
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