Electronic device and manufacturing method of electronic device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10081161
APP PUB NO 20160257093A1
SERIAL NO

15001893

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Abstract

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A manufacturing method of an electronic device includes a first stacking process of forming a first photosensitive adhesive on a surface on a second substrate side in a first substrate; and a second stacking process of forming a second photosensitive adhesive, which overlaps the first photosensitive adhesive, having a lower degree of cure than that of the first photosensitive adhesive; and a bonding process of bonding together the first substrate and the second substrate by curing the second photosensitive adhesive by heating, in a state in which the first photosensitive adhesive and the second photosensitive adhesive are interposed between the first substrate and the second substrate.

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Patent Owner(s)

  • SEIKO EPSON CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Saito, Tomoyoshi Chino, JP 4 14
Yoshiike, Masashi Chino, JP 10 16

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