MULTI-LAYER WEB AND PROCESS FOR FORMING SCORED LIDDING FILM FOR BLISTER PACKAGES
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 8, 2016
app pub date -
Mar 4, 2015
filing date -
Mar 4, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Multi-layer web and mechanical scoring process for forming lidding film for push through blister packages. The web is configured to resist the tensile forces encountered during manufacturing processes, including slitting, rewinding and heat sealing processes. A simplified web conversion process for creating mechanically scored lidding film for blister packages is provided at reduced investment and operational costs compared to prior art systems.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully