ETCHANT COMPOSITION FOR TITANIUM NITRIDE LAYER AND METHOD FOR FORMING METAL WIRE USING THE SAME
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Feb 26, 2016
filing date -
Mar 5, 2015
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Abstract
The present invention provides an etchant composition for a TiN layer including (A) at least one compound selected from sulfuric acid and alkyl sulfonic acid in 75% by weight to 95% by weight, (B) a peroxide in 0.3% by weight to 10% by weight, (C) an inorganic ammonium salt in 0.0001% by weight to 3% by weight, and (D) water in a residual quantity, and a method for forming a metal wire using the etchant composition.
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