Semiconductor device for preventing crack in pad region and fabricating method thereof
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United States of America Patent
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Apr 28, 2020
Grant Date -
Sep 8, 2016
app pub date -
May 12, 2016
filing date -
May 10, 2010
priority date (Note) -
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Abstract
A semiconductor device which prevents a crack from occurring on a pad region is provided. The semiconductor device includes a lower pad, an upper pad which is formed above the lower pad, an insulation layer which is formed between the lower pad and the upper pad, a via net for electrically connecting the lower pad and the upper pad in the insulation layer, the via net having a net shape in which a unit grid is connected with its adjacent unit grids to form a net structure, and at least one via hole for electrically connecting the lower pad and the upper pad in the unit grid of the via net.
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