METHODS AND APPARATUS INCLUDING INTEGRATED CONDUCTING AND INDUCTIVE ELEMENT FOR PROVIDING CURRENT
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United States of America Patent
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Issued Date -
Sep 8, 2016
app pub date -
Mar 2, 2015
filing date -
Mar 2, 2015
priority date (Note) -
Published
status (Latency Note)
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Abstract
Apparatus include(s) a package having a load, and methods of making an electronic circuit include disposing the package on a printed circuit board. The apparatus include(s) an integrated conducting element and inductive element disposed on the printed circuit board and connected to the package that includes the load. The methods include disposing the integrated conducting element and inductive element on the printed circuit board so that the integrated conducting element and inductive element connects to the package. The integrated conducting element and inductive element includes a conducting element integral with an inductive element. The inductive element includes a magnetic element and a winding element. The winding element comprises a portion of the conducting element.
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