Printed circuit board having reduced loss of electric signal and method of manufacturing the same

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United States of America Patent

PATENT NO 9955579
SERIAL NO

15057518

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Importance

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Abstract

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A printed circuit board includes first and second insulating layers, a wiring trace, a metal thin film, and a connection terminal. The wiring trace is formed on the first insulating layer. The metal thin film is formed on the wiring trace, and has a thickness larger than 0 nm and not more than 150 nm. The second insulating layer is formed on the first insulating layer to cover the metal thin film. The connection terminal is formed on the first insulating layer to be electrically connected to the wiring trace and exposed from the second insulating layer.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanabe, Hiroyuki Ibaraki, JP 83 470
Yamauchi, Daisuke Ibaraki, JP 25 95

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