Liquid ejecting head and method of manufacturing liquid ejecting head
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United States of America Patent
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-
Feb 13, 2018
Issued Date -
N/A
app pub date -
Jan 26, 2016
filing date -
Mar 10, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A liquid ejecting head and a method of manufacturing the liquid ejecting head are provided. The liquid ejecting head has a pressure chamber forming substrate that includes a plurality of piezoelectric elements and that is connected to a first surface of a sealing plate, a driver IC that outputs signals that drive the piezoelectric elements and that is provided on a second surface of the sealing plate that is on the opposite side to the first surface, and a power supply wire that supplies electrical power to the piezoelectric elements, that is formed in the second surface of the sealing plate, and that has at least one portion thereof embedded in the sealing plate and a surface thereof exposed on the second surface side.
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