Semiconductor device
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United States of America Patent
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Apr 17, 2018
Issued Date -
N/A
app pub date -
Sep 15, 2015
filing date -
Mar 11, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device according to an embodiment includes a semiconductor layer, a first insulating film provided on the semiconductor layer, a first conductive layer provided on the first insulating film, a second insulating film provided on the semiconductor layer and the first conductive layer, a second conductive layer provided on the second insulating film, a first contact portion connecting the semiconductor layer and the second conductive layer, and a second contact portion connecting the first conductive layer and the second conductive layer. A distance between the semiconductor layer and an upper portion of the second insulating film adjacent to the second contact portion is greater than a distance between the semiconductor layer and an upper portion of the second insulating film adjacent to the first contact portion. The second contact portion has a larger width than the first contact portion.
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