Semiconductor device and method of manufacturing the same

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United States of America Patent

PATENT NO 9595507
APP PUB NO 20160268232A1
SERIAL NO

14839676

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Abstract

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According to one embodiment, a semiconductor device includes a laminate including a plurality of semiconductor chips and having a first width, at least part of the semiconductor chips including an electrode extending through the semiconductor chip, the semiconductor chips being stacked and connected to each other via the electrode; a silicon substrate provided on a first surface of the laminate and having a second width larger than the first width; a wiring layer provided on a second surface of the laminate; and a resin provided around the laminate.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kurita, Yoichiro Tokyo, JP 113 1498

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