Semiconductor device

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United States of America Patent

PATENT NO 9773769
APP PUB NO 20160268242A1
SERIAL NO

15055278

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Abstract

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A semiconductor device includes a substrate, a semiconductor package including a semiconductor chip, and a connector between the substrate and the semiconductor package, the connector having opposing first and second planar surfaces, the first planar surface in contact with the substrate and the second planar surface in contact with the semiconductor package. The connector also includes a plurality of wires extending between the first and second planar surfaces to electrically connect electrodes of the substrate to electrodes of the semiconductor package.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikarashi, Satoshi Yokohama Kanagawa, JP 2 1

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