Semiconductor memory device
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United States of America Patent
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Mar 28, 2017
Issued Date -
N/A
app pub date -
Aug 24, 2015
filing date -
Mar 13, 2015
priority date (Note) -
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Abstract
According to one embodiment, a semiconductor memory device includes a substrate; a first stacked body provided on the substrate, the first stacked body including a plurality of electrode layers and a plurality of insulating layers, each of the plurality of insulating layers being provided between the plurality of electrode layers; a semiconductor film provided in the first stacked body and extending in a stacking direction of the first stacked body; and a second stacked body provided on the substrate and separately from the first stacked body, the second stacked body including a same layer structure as the first stacked body. The second stacked body includes a first contact portion electrically connected to an external portion; and a second contact portion electrically connected to an external portion different from the first contact portion.
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