SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Sep 15, 2016
app pub date -
Aug 3, 2015
filing date -
Mar 13, 2015
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Abstract
According to one embodiment, a stacked body of N layers is stacked on a semiconductor substrate, steps are provided in the stacked body such that upper layers are retracted behind lower layers, N lower openings are provided in correspondence with the individual layers of the stacked body and are equal in depth, one to N upper openings are provided on one to N lower openings and are different in depth, N lower-layer contact electrodes are provided in the lower openings, and one to N upper-layer contact electrodes are provided in the upper openings.
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