Resin sheet for sealing electronic device and method for manufacturing electronic-device package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10297470
APP PUB NO 20160269000A1
SERIAL NO

15032105

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Abstract

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Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shiga, Goji Ibaraki, JP 50 207
Shimizu, Yusaku Ibaraki, JP 14 50
Toyoda, Eiji Ibaraki, JP 68 574

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