Manufacturing a product using a soldering process

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United States of America Patent

PATENT NO 10010000
SERIAL NO

15158831

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.

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Patent Owner(s)

  • IBM CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chamberlin, Bruce J Endicott, US 47 296
Huber, Andreas Boeblingen, DE 184 1208
Huels, Harald Boeblingen, DE 25 186
Winkel, Thomas-Michael Boeblingen, DE 23 90

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