ADHESIVE FOR MOUNTING ELECTRONIC COMPONENT AND ADHESIVE FILM FOR MOUNTING FLIP CHIP
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United States of America Patent
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Issued Date -
Sep 22, 2016
app pub date -
Feb 27, 2015
filing date -
Mar 4, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention aims to provide an adhesive for mounting an electronic component. The adhesive enables sufficient soldering while preventing solder flow in a short mounting time, suppresses voids, and is excellent in reflowing resistance. The present invention also aims to provide an adhesive film for mounting a flip chip including the adhesive for mounting an electronic component. The present invention relates to an adhesive for mounting an electronic component including: an acrylic polymer having a (meth)acryloyl group in a side chain and having a double bond equivalent of 1 to 5 meq/g; a tri- or higher functional (meth)acrylate compound; and a radical polymerization initiator.
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