Semiconductor manufacturing method and laminated body

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9997390
APP PUB NO 20160276201A1
SERIAL NO

15064941

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Abstract

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A semiconductor manufacturing method according to a present embodiment includes forming a supporter on a second surface of a semiconductor substrate opposite to a first surface to be ground of the semiconductor substrate. The semiconductor manufacturing method includes thinning the thickness of the semiconductor substrate by grinding the first surface. In the semiconductor manufacturing method, the supporter contains a resin.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takano, Eiji Oita, JP 23 138

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