Semiconductor package and mobile device using the same
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United States of America Patent
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Aug 1, 2017
Issued Date -
N/A
app pub date -
May 31, 2016
filing date -
Jul 15, 2010
priority date (Note) -
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Abstract
According to an embodiment, a semiconductor package includes a semiconductor chip mounted on an interposer board, a encapsulant sealing the semiconductor chip, and a conductive shielding layer covering the encapsulant and at least part of a side surface of the interposer board. The interposer board has plural vias through an insulating substrate. A part of the plural vias has a cutting plane exposing to the side surface of the interposer board and cut in a thickness direction of the interposer board. The cutting plane of the via is electrically connected to the conductive shielding layer.
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