SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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United States of America Patent
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Sep 22, 2016
app pub date -
Sep 3, 2015
filing date -
Mar 16, 2015
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Abstract
According to one embodiment, a semiconductor device includes: a semiconductor substrate; and an insulating film provided above the semiconductor substrate. The insulating film includes: a plurality of first particles having a periodic structure; a plurality of second particles provided between the plurality of first particles and having an average particle outline size smaller than an average particle outline size of the plurality of first particles; and a filler provided between at least one of the plurality of first particles and the plurality of second particles.
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