Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 13, 2017
Issued Date -
N/A
app pub date -
May 31, 2016
filing date -
Oct 3, 2011
priority date (Note) -
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Abstract
A microelectronic assembly (300) or system (1500) includes at least one microelectronic package (100) having a microelectronic element (130) mounted face up above a first surface (108) of a substrate (102), one or more columns (138, 140) of contacts (132) extending in a first direction (142) along the microelectronic element front face. Columns (104A, 105B, 107A, 107B) of terminals (105 107) exposed at a second surface (110) of the substrate extend in the first direction. First terminals (105) exposed at surface (110) in a central region (112) thereof having width (152) not more than three and one-half times a minimum pitch (150) of the columns of terminals can be configured to carry address information usable to determine an addressable memory location. An axial plane of the microelectronic element can intersect the central region.
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