LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160276555A1
SERIAL NO

15068360

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A light emitting device manufacturing method includes: bonding a second film having an adhesive layer formed thereon to a substrate having bonded on a surface of a first film and transferring the adhesive layer onto the surface of the substrate; peeling off and removing the second film from the substrate; adhering and fixing a lead member to the adhesive layer; peeling off and removing the first film from the substrate; mounting a light emitting element on the lead member; and sealing the light emitting element and the lead member with a sealing material using a potting method to form a package.

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Patent Owner(s)

Patent OwnerAddress
TOYODA GOSEI CO LTDKIYOSU-SHI AICHI 452-8564

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ITO, Hiroshi Kiyosu-shi, JP 806 10492
YAJIMA, Takayoshi Kiyosu-shi, JP 8 107

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