Light-Emitting Diode Package With Substantially In-Plane Light Emitting Surface and Fabrication Method
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United States of America Patent
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Issued Date -
Sep 22, 2016
app pub date -
Mar 18, 2015
filing date -
Mar 18, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present specification discloses a novel light emitting diode package having a package substrate with a light emitting layer bonded to the package substrate. Unlike conventional LED packages (such as those shown in FIGS. 1 and 2), the chip handling substrate typically located between the package substrate and the light emitting layer is not present. In addition, the LED package of the present specification may comprise an insulating layer formed on the package substrate and the light emitting layer. The LED package of the present specification may further comprise an interconnect metal formed on the insulating layer and the light emitting layer, wherein the interconnect metal electrically connects the light emitting layer to the package substrate.
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