LASER DRILLING THROUGH MULTI-LAYER COMPONENTS

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United States of America Patent

SERIAL NO

14669071

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Abstract

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There is described herein a method and system for drilling holes in components having multiple layers of materials using a laser emitting device, by controlling the laser pulses in such a way that cracks at the interfaces between the various materials are minimized or eliminated.

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Patent Owner(s)

Patent OwnerAddress
PRATT & WHITNEY CANADA CORP1000 MARIE-VICTORIN (01BE5) LONGUEUIL QUEBEC J4G 1A1

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
STRACH, Ludwik McMasterville, CA 1 0

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