Electrodeposition of Copper
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United States of America Patent
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Sep 29, 2016
app pub date -
Nov 25, 2014
filing date -
Nov 25, 2013
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Abstract
In electrolytic copper plating, an aqueous composition comprising a source of copper ions and at least one alkylene or polyalkylene glycol monoether which is soluble in the aqueous phase and has molecular weight not greater than about 500 for improving the efficacy of other additives such as, for example, levelers and suppressors; and a related plating method.
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