CAPACITIVE SENSING ASSEMBLY INCLUDING A THIN FILM PLASTIC
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United States of America Patent
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Sep 29, 2016
app pub date -
Mar 23, 2015
filing date -
Mar 23, 2015
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Abstract
A capacitive sensing stackup is disclosed that includes: a thin film plastic; an injection molded plastic component bonded to the thin film plastic, wherein the injection molded plastic component forms a cavity bounded by the injection molded plastic and the thin film plastic that exposes at least a portion of the thin film plastic; and, a capacitive sensor assembly including a plurality of sensor electrodes configured to be driven with a capacitive sensing signal, wherein the capacitive sensor assembly is coupled to the thin film plastic in the cavity formed by the injection molded plastic component.
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