Semiconductor manufacturing apparatus and semiconductor manufacturing method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9558936
APP PUB NO 20160284533A1
SERIAL NO

14832040

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Abstract

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In one embodiment, a semiconductor manufacturing apparatus includes an accommodation module configured to accommodate a substrate. The apparatus further includes a first flow channel including first openings configured to emit a first gas into the accommodation module. The apparatus further includes a second flow channel including second openings configured to emit the first gas into the accommodation module, a number or a size of the second openings being different from a number or a size of the first openings. The apparatus further includes a controller configured to control supplying of the first gas to the first and second flow channels such that the first gas is emitted from the first openings at a first flow velocity and the first gas is emitted from the second openings at a second flow velocity different from the first flow velocity.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagano, Hajime Yokkaichi, JP 66 1047

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