Semiconductor structures having low resistance paths throughout a wafer

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United States of America Patent

PATENT NO 9691623
SERIAL NO

15178893

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Abstract

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A semiconductor structure with low resistance conduction paths and methods of manufacture are disclosed. The method includes forming at least one low resistance conduction path on a wafer, and forming an electroplated seed layer in direct contact with the low resistance conduction path.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gambino, Jeffrey P Portland, US 531 7321
Hartswick, Thomas J Underhill, US 17 202
He, Zhong-Xiang Essex Junction, US 175 1736
Stamper, Anthony K Williston, US 613 6570
White, Eric J Charlotte, US 53 616

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