Semiconductor die assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9601374
APP PUB NO 20160284675A1
SERIAL NO

14669780

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Abstract

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A semiconductor die assembly having a solderball wirebonded to a substrate. As an example, the semiconductor die assembly may include the solderball attached to a bond pad on a face surface of a memory die. A non-face surface of the memory die can be attached to the substrate. A wire can be wirebonded to the solderball at a first end of the wire and connected to the substrate at a second end of the wire.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fay, Owen R Meridian, US 107 881
Foster, Liana Boise, US 3 4

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