USE OF AMBIENT-ROBUST SOLUTION PROCESSING FOR PREPARING NANOSCALE ORGANIC FERROELECTRIC FILMS
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United States of America Patent
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Sep 29, 2016
app pub date -
Jun 1, 2015
filing date -
Sep 12, 2014
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Abstract
Disclosed is a method for preparing a ferroelectric film having ferroelectric hysteresis properties, the method comprising (a) obtaining a composition comprising a solvent and an organic ferroelectric polymer solubilized therein, (b) heating the composition to above 75° C. and below the boiling point of the solvent, (c) depositing the heated composition onto a substrate; and (d) annealing the heated composition to form a ferroelectric film having ferroelectric hysteresis properties and a thickness of 400 nm or less.
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