Simplified process for vertical LED manufacturing
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United States of America Patent
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Nov 22, 2016
Grant Date -
Sep 29, 2016
app pub date -
Jun 19, 2015
filing date -
Mar 25, 2015
priority date (Note) -
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Abstract
Techniques for integrating spalling into layer transfer processes involving optical device semiconductor materials are provided. In one aspect, a layer transfer method for an optical device semiconductor material includes forming the optical device semiconductor material on a first substrate; depositing a metal stressor layer on top of the optical device semiconductor material; attaching a first handle layer to the metal stressor layer; removing the optical device semiconductor material from the first substrate by pulling the first handle layer away from the first substrate; attaching a second handle layer to the optical device semiconductor material; removing the first handle layer from the stack; and forming a second substrate on the stressor layer. Vertical LED devices and techniques for formation thereof are also provided.
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