ELECTRODE BONDING APPARATUS AND ELECTRODE BONDING METHOD
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United States of America Patent
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Nov 6, 2013
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Nov 6, 2013
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Abstract
The present invention has an object to provide an electrode bonding apparatus that performs ultrasonic vibration bonding on points of an electrode and is capable of reducing variations in a peel force among the points even when the electrode is bonded onto the substrate at a lower peel force. According to the present invention, a collecting electrode (20A, 20B) is disposed along a side (L1, L2) of a glass substrate (1) on a solar cell (ST1). Then, the glass substrate is pressed along the side in a region of the glass substrate between the side and an arrangement position of the collecting electrode. During application of the pressure, the ultrasonic vibration bonding is performed on the collecting electrode using an ultrasonic vibration tool (14).
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