MEMS PACKAGING
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 6, 2016
app pub date -
Mar 31, 2015
filing date -
Mar 31, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A packaged electronic component comprising at least one movable part, comprising lower and upper layers, each formed with a depression in an inwards-facing side of the component, the depressions forming a cavity within the component, a MEMs component rigidly joined at least one proximal location to the lower and upper layers, wherein the MEMs component extends from the at least one proximal location into the cavity such that a distal region of the MEMs component can move within the cavity.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully