SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
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United States of America Patent
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Issued Date -
Oct 6, 2016
app pub date -
Sep 18, 2015
filing date -
Mar 31, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A substrate processing apparatus includes a reception part configured to receive film thickness distribution data of a substrate on which a channel region, an insulating film on the channel region, and a first silicon-containing layer as a portion of a silicon-containing film on the insulating film are formed; a substrate mounting part configured to mount the substrate; and a gas supply part configured to supply a gas to form a second silicon-containing layer as a portion of the silicon-containing film on the first silicon-containing layer to have a film thickness distribution different from a film thickness distribution of the film thickness distribution data, thereby correcting a film thickness of the silicon-containing film.
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