Housing for a semiconductor chip, housing composite, semiconductor component and method of producing a semiconductor component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9685593
APP PUB NO 20160293804A1
SERIAL NO

15036465

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Importance

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Abstract

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A housing for a semiconductor chip has a front side and a rear side opposite the front side, wherein the front side has a fastening area for the semiconductor chip; the rear side has a mounting area to mount the housing, wherein the mounting area runs obliquely to the fastening area; and the rear side has a resting area running parallel to the fastening area.

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First Claim

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Patent Owner(s)

  • OSRAM OPTO SEMICONDUCTORS GMBH

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haslbeck, Stephan Regensburg, DE 7 17
Haushalter, Martin Regensburg, DE 19 132

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