PRE-RELEASE ENCAPSULATION OF ELECTROMECHANICAL SYSTEM DEVICES
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United States of America Patent
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app pub date -
Apr 9, 2015
filing date -
Apr 9, 2015
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Abandoned
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Abstract
This disclosure provides systems, methods and apparatus for packaging an array of electromechanical systems (EMS) devices such as interferometric modulators (IMODs). In one aspect, a backplate including an aperture can be sealed to a substrate supporting an array of unreleased EMS devices to form a package. A release etch may be performed through the aperture after sealing the backplate to the substrate. By performing the release etch after sealing the backplate to the substrate, the effect on the array of EMS devices of the formation and outgassing of the sealant material can be reduced.
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