HEAT-ASSISTED-MAGNETIC-RECORDING HEAD, SEMICONDUCTOR LASER ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR LASER ELEMENT
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United States of America Patent
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Issued Date -
Oct 13, 2016
app pub date -
Sep 2, 2014
filing date -
Oct 17, 2013
priority date (Note) -
Abandoned
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Abstract
In a semiconductor laser device including a semiconductor laser element that emits laser light from an emission region thereof, a cap having a peripheral wall and a ceiling wall that cover the semiconductor laser element and having a window portion formed in the ceiling wall to face the emission region, and a transparent optical member that fills the window portion, the optical member is formed by curing a liquid resin and holds the ceiling wall, and a light incidence surface of the optical member faces the emission region and is formed by natural flow of the liquid resin.
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