Substrate support with thermal zones for semiconductor processing
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United States of America Patent
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Jul 21, 2020
Grant Date -
Oct 13, 2016
app pub date -
Jun 15, 2016
filing date -
Oct 21, 2009
priority date (Note) -
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Abstract
A substrate support in a semiconductor plasma processing apparatus, comprises multiple independently controllable thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the thermal zones. A substrate support in which the substrate support is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the substrate support include bonding together ceramic or polymer sheets having thermal zones, power supply lines, power return lines and vias.
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