Semiconductor device and method of forming a package in-fan out package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10068862
APP PUB NO 20160300817A1
SERIAL NO

15082190

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A semiconductor device comprises a first semiconductor package including a first interconnect structure extending over a surface of the first semiconductor package. The first semiconductor package includes an interposer and a second semiconductor die disposed over the interposer. A second encapsulant is deposited over the interposer and second semiconductor die. A first semiconductor die is disposed over the surface of the first semiconductor package. A second interconnect structure extends from the first semiconductor die opposite the first semiconductor package. A first encapsulant is deposited over the first semiconductor package and first semiconductor die. A portion of the first encapsulant over the first interconnect structure and second interconnect structure is removed. A discrete component is disposed on the surface of the first semiconductor package. A build-up interconnect structure is formed over the first semiconductor package and first semiconductor die. The first semiconductor package includes a molded laser package.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • STATS CHIPPAC PTE. LTD.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Do, Byung Tai Singapore, SG 246 5097
Trasporto, Arnel Senosa Singapore, SG 61 486

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Mar 4, 2026
11.5 Year Payment $7400.00 $3700.00 $1850.00 Mar 4, 2030
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00