SHAPED CAVITY FOR SIGE FILLING MATERIAL

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United States of America Patent

APP PUB NO 20160308051A1
SERIAL NO

14706988

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Abstract

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The present invention is directed to semiconductor processes and devices. More specifically, embodiments of the present invention provide a semiconductor device that comprises a modified diamond-shaped cavity, and the shaped cavity is filled with silicon and germanium material. There are other embodiments as well.

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Patent Owner(s)

Patent OwnerAddress
SHANGHAI HUALI MICROELECTRONICS CORPORATIONNO 6 LIANGTENG ROAD PUDONG NEW AREA SHANGHAI 201314

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tan, Jun Shanghai, CN 154 876
Zhou, Haifeng Shanghai, CN 30 158

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