ELECTROLESS PLATING METHOD AND ELECTROLESS PLATING FILM
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United States of America Patent
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Oct 27, 2016
app pub date -
Oct 6, 2015
filing date -
Apr 24, 2015
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Abstract
An electroless plating method of an embodiment includes: a step of preparing a catalyst solution containing titanium alkoxide, a copper ion, a naphthoquinonediazide esterification product, and methoxyethoxyacetic acid; a step of coating a substrate with the catalyst solution; a step of patterning the coating film; a step of converting the coating film to a catalyst precursor film; a step of immersing the catalyst precursor film in a reducing agent-containing aqueous solution to reduce the copper ion to metal; and a step of forming an electroless copper plating film.
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