Device Including a Logic Semiconductor Chip Having a Contact Electrode for Clip Bonding

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United States of America Patent

APP PUB NO 20160315033A1
SERIAL NO

15135155

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Abstract

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A device includes a logic semiconductor chip having a contact electrode. The contact electrode is configured to be electrically coupled to a contact clip based on a clip bonding technique.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AUSTRIA AGSIEMENSSTRASSE 2 VILLACH 9500

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoeglauer, Josef Heimstetten, DE 76 425
Otremba, Ralf Kaufbeuren, DE 242 2185
Subotski, Aliaksandr Villach, AT 5 3

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