METHOD FOR CUTTING WORKPIECE
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United States of America Patent
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Jan 9, 2015
filing date -
Jan 9, 2014
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Abstract
A method for cutting a workpiece except silicon includes moving a resin-coated saw wire having a resin coating that covers the surface of a steel wire. In the method, at least one of the resin-coated saw wire or the workpiece is swung, a diamond abrasive grain having an average grain size of more than 0 μm and 8 μm or less is sprayed onto the resin-coated saw wire, and a wire running speed of the resin-coated saw wire is 800 m/min or higher.
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