Cured thermoset for high thermal conductive materials

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United States of America Patent

PATENT NO 9908988
APP PUB NO 20160326339A1
SERIAL NO

15108794

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150° C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.

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Patent Owner(s)

  • DOW GLOBAL TECHNOLOGIES LLC;ROHM AND HAAS COMPANY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hongyu Zhangjiang, CN 160 1314
Huang, Yan Shanghai, CN 188 1143
Liu, Wei Shanghai, CN 1787 13681
Song, Xiaomei Shanghai, CN 18 15
Zhang, Yu Shanghai, CN 1633 7768

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