THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ANDELECTRIC/ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Nov 10, 2016
app pub date -
Jan 15, 2015
filing date -
Jan 29, 2014
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Abstract
A thermosetting resin composition containing a polyfunctional (meth)acrylate (a), a high-thermal-conductivity filler (b) having a thermal conductivity of 20 to 250 W/m·K, a curing agent (c), and a copolymer (d) having an acid group containing phosphoric acid, wherein the amount of the high-thermal-conductivity filler (b) is from 1600 to 2100 parts by mass per 100 parts by mass of the polyfunctional (meth)acrylate (a), and the amount of the copolymer (d) having an acid group containing phosphoric acid is from 7.5 to 30 parts by mass per 100 parts by mass of the polyfunctional (meth)acrylate (a).
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