Three-dimensional (3D) photonic chip-to-fiber interposer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 4, 2017
Issued Date -
N/A
app pub date -
May 4, 2015
filing date -
May 4, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of fabricating an optical coupling device, comprising forming a waveguide mask layer on a substrate platform, wherein the waveguide mask layer comprises an array of openings comprising a first end and a second end opposite to the first end, immersing the substrate platform into a salt melt comprising ions to form an array of waveguides in the substrate platform through an ion diffusion process, and controlling a rate of immersion such that a diffusion depth of the ions varies as a function of a distance in a direction from the first end to the second end, wherein the array of waveguides extends in the direction from the first end to the second end.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully