SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 10, 2016
app pub date -
May 2, 2014
filing date -
May 7, 2013
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
One device includes a first chip having first electrodes on one surface, and a rough portion on another surface. The device also includes a second chip having second electrodes on one surface, and third electrodes electrically connected to the second electrodes and disposed on another surface, and stacked on the first chip so the third electrodes are electrically connected to the first electrodes. The device includes a resin layer covering the first and second chips so at least the other surface of the first chip and the one surface of the second chip are exposed. The device also includes a wiring board having connection pads formed on one surface, and stacked on the second chip so the connection pads are electrically connected to the second electrodes. The device includes a sealing resin portion formed on the wiring board to cover the first chip, the second chip, and the resin layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully